Advanced Power Semiconductor
Packaging & Assembly solutions
From concept to mass production
Lynx Packaging Technologies provides end-to-end solutions
reducing cost, risks and time-to-market
Specialists in Power Packaging
30+ years R&D expertise in thermal management, assembly & testing turning customer ideas to mass production, reducing development cost/time & ensuring long-term reliability.
Package and Process Design
Plastic and molded modules, heatsinks, liquid/forced air cooling techniques.
FEM simulation
Mechanical, electrical, thermal (Rth/Zth/Cross talking), RLC, CFD.
Behavior and lifespan simulation according to mission profile.
Prototyping & Industrialization
Robust assembly techniques, Ag/Cu sintering, high-strength bonding materials, Frontend/Backend compatibility (CPI)
Supporting industries demanding
Power, Efficiency & Reliability
enabling our partners to achieve a more efficient power conversion
E-Mobility
SiC/GaN/IGBT modules and packages, supporting Ag sintering for efficient propulsion &, charging.
AI & Datacenter
Customized power packages for AI Motherboards & Power Supply, delivering constant power efficiently.
Industrial & Renewable
Plastic modules and Discrete packages offering high temperature capability, minimized parasitics and high-power-density.
Our design capability
With our expertise and experience, we can address challenging requirements.
We can design and prototype any package or module including Plastic, Molded, customized discrete devices or PCB-embedded die.
Plastic modules
Baseplate/-less equipped with direct cooling (pin fins) e indirect cooling with TIM (thermal interface material). Supporting Ag/Cu sintering, allow to implement customized complex topologies.
Molded modules
Superior thermal management, minimized parasitic inductance and high-power-density designs achieved through 3D and System-in-Package integration. Large area soldering / sintering for best thermal and mechanical performances
Customized discrete packages
Designed to meet customer’s requirement in terms of PCB real-estate and Board Level Reliability, Max case temperature, cost.
